发明名称 Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
摘要 Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
申请公布号 US9018343(B2) 申请公布日期 2015.04.28
申请号 US201214347895 申请日期 2012.09.27
申请人 Kolon Industries, Inc. 发明人 Park Hyo Jun;Jung Hak Gee
分类号 C08G69/26;C08G73/14;C08L79/08;C08G73/10;G02F1/1337 主分类号 C08G69/26
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized.
地址 Gyeonggi-do KR