| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes: a substrate; first and second pads disposed adjacent to each other on the substrate; an electrically conductive tape adhered to the first and second pads and having a through hole at an inner portion of the first pad; an electrically conductive adhesive in the through hole and having a thermal conductivity higher than the thermal conductivity of the electrically conductive tape; a semiconductor chip mounted on the first pad via the electrically conductive adhesive; and an electronic component part mounted on the second pad via the electrically conductive tape. | ||
| 申请公布号 | US9018775(B2) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201414222723 | 申请日期 | 2014.03.24 |
| 申请人 | Mitsubishi Electric Corporation | 发明人 | Yamamoto Yasukazu;Miyawaki Katsumi |
| 分类号 | H01L23/00 | 主分类号 | H01L23/00 |
| 代理机构 | Leydig, Voit & Mayer, Ltd. | 代理人 | Leydig, Voit & Mayer, Ltd. |
| 主权项 | 1. A semiconductor device comprising: a substrate; first and second pads disposed adjacent to each other on the substrate; an electrically conductive tape adhered to the first and second pads and having a through hole at an inner portion of the first pad; an electrically conductive adhesive in the through hole and having a thermal conductivity higher than thermal conductivity of the electrically conductive tape; a semiconductor chip mounted on the first pad via the electrically conductive adhesive; and an electronic component part mounted on the second pad via the electrically conductive tape. | ||
| 地址 | Tokyo JP | ||