Mechanisms for forming bump structures over wide metal pad

摘要

Embodiments of mechanisms for forming a semiconductor die are provided. The semiconductor die includes a semiconductor substrate and a protection layer formed over the semiconductor substrate. The semiconductor die also includes a conductive layer conformally formed over the protection layer, and a recess is formed in the conductive layer. The recess surrounds a region of the conductive layer. The semiconductor die further includes a solder bump formed over the region of the conductive layer surrounded by the recess.

主权项

1. A semiconductor die, comprising:
a semiconductor substrate; a protection layer formed over the semiconductor substrate; a conductive layer conformally formed over the protection layer, wherein a recess is formed in the conductive layer, and the recess surrounds a region of the conductive layer; and a solder bump formed over the region of the conductive layer surrounded by the recess, wherein the conductive layer is wider than the solder bump.