Printed circuit board and method for manufacturing the same

摘要

The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern formed on the second insulator, and it is possible to reduce a size of the via without increasing an aspect ratio.

主权项

1. A printed circuit board comprising:
a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad, of which a first portion is embedded in the second insulator and of which a second portion is protruded out of the second insulator, and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern integrally formed with the second portion of the pad, and formed on one part of a top surface of the second insulator such that at least a portion of another part of the top surface of the second insulator is exposed out of the third circuit pattern.