| 摘要 |
The present invention relates to a method for manufacturing an interposer, a stacked package using the same, and a manufacturing method thereof. The method for manufacturing an interposer according to the present invention includes the steps of: cutting an interposer substrate made of a single layer composed of insulating mateiral with a preset size; forming a via hole and an opening part (H) to receive a semiconductor chip on the interposer substrate; and forming a connection part by filling the via hole with conductive paste and sintering the conductive paste. |
