发明名称 |
MOSFETs with channels on nothing and methods for forming the same |
摘要 |
A method includes performing an epitaxy to grow a semiconductor layer, which includes a top portion over a semiconductor region. The semiconductor region is between two insulation regions that are in a substrate. The method further includes recessing the insulation regions to expose portions of sidewalls of the semiconductor region, and etching a portion of the semiconductor region, wherein the etched portion of the semiconductor region is under and contacting a bottom surface of the semiconductor layer, wherein the semiconductor layer is spaced apart from an underlying region by an air gap. A gate dielectric and a gate electrode are formed over the semiconductor layer. |
申请公布号 |
US9018063(B2) |
申请公布日期 |
2015.04.28 |
申请号 |
US201414289735 |
申请日期 |
2014.05.29 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Vellianitis Georgios;van Dal Mark;Duriez Blandine |
分类号 |
H01L29/06;H01L29/78;H01L29/10;H01L21/306;H01L29/66 |
主分类号 |
H01L29/06 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method comprising:
performing an epitaxy to grow a semiconductor layer, wherein the semiconductor layer comprises a top portion over a semiconductor region, and wherein the semiconductor region is between two insulation regions that are in a substrate; recessing the insulation regions to expose portions of sidewalls of the semiconductor region; etching a portion of the semiconductor region, wherein an etched portion of the semiconductor region is under and contacting a bottom surface of the semiconductor layer, wherein the semiconductor layer is spaced apart from an underlying region by an air gap; forming a gate dielectric over the semiconductor layer; and forming a gate electrode over the gate dielectric. |
地址 |
Hsin-Chu TW |