发明名称 |
Copper alloy composite and method for manufacturing same |
摘要 |
A method for preparing a copper alloy given a certain special surface shape yields tremendous bonding strength through compatibility with an epoxy resin adhesive. With a composite part in which this technology is utilized to integrate a copper alloy member as a cover material with a CFRP, it is possible to take advantage of the characteristics of both the copper alloy and the FRP due to the tremendous bonding strength. In a step in which an FRP prepreg is put into a mold and heated and cured, usually the mold is first coated with a release agent to facilitate release from the mold, but with high-technology CFRP, bleeding of the release agent often diminishes the properties. A copper alloy sheet 21 is used as a cover material, and a CFRP 22 is cured. |
申请公布号 |
US9017569(B2) |
申请公布日期 |
2015.04.28 |
申请号 |
US201414223337 |
申请日期 |
2014.03.24 |
申请人 |
Taisei Plas Co., Ltd. |
发明人 |
Naritomi Masanori;Andoh Naoki |
分类号 |
C03C15/00;B32B37/02;C23F1/18;B29C70/08;B32B7/12;B32B15/14;B32B27/04;B29K705/10 |
主分类号 |
C03C15/00 |
代理机构 |
Westerman, Hattori, Daniels & Adrian, LLP |
代理人 |
Westerman, Hattori, Daniels & Adrian, LLP |
主权项 |
1. A method for manufacturing a copper alloy composite, comprising:
a step of shaping a copper alloy part by machining from a casting or an intermediate material; a chemical etching step of immersing the shaped copper alloy part in an acidic aqueous solution containing an oxidant; a surface hardening step of immersing the chemically etched copper alloy part in a strongly basic aqueous solution containing an oxidant; a step of coating the hardened surface of the copper alloy part with an uncured epoxy resin; a step of adjusting a prepreg of a fiber-reinforced plastic by adjusting a size of the prepreg; a step of applying the prepreg to the coated side of the copper alloy part; and a step of positioning the prepreg and the copper alloy part, and heating the prepreg and the copper alloy part while holding them down, to cure the epoxy resin component. |
地址 |
Tokyo JP |