发明名称 |
Method of fabricating gallium nitride-based semiconductor device |
摘要 |
A method of fabricating a gallium nitride (GaN)-based semiconductor device. The method includes preparing a GaN substrate having lower and upper surfaces; growing GaN-based semiconductor layers on the upper surface of the GaN substrate to form a semiconductor stack; forming a support substrate on the semiconductor stack; and separating the GaN substrate from the semiconductor stack. The separating of the GaN substrate includes irradiating a laser from the lower surface of the GaN substrate. The laser is transmitted through the lower surface of the GaN substrate and forms a laser absorption region inside a structure consisting of the GaN substrate and the semiconductor stack. |
申请公布号 |
US9018027(B2) |
申请公布日期 |
2015.04.28 |
申请号 |
US201313950958 |
申请日期 |
2013.07.25 |
申请人 |
Seoul Viosys Co., Ltd. |
发明人 |
Im Tae Hyuk;Kim Chang Yeon;Kim Young Wug |
分类号 |
H01L21/02;H01L33/00;H01L33/32 |
主分类号 |
H01L21/02 |
代理机构 |
H.C. Park & Associates, PLC |
代理人 |
H.C. Park & Associates, PLC |
主权项 |
1. A method of fabricating a gallium nitride (GaN)-based semiconductor device, the method comprising:
growing GaN-based semiconductor layers on an upper surface of a GaN substrate to form a semiconductor stack; forming a support substrate on the semiconductor stack; scanning a laser across a lower surface of the GaN substrate, the laser emitting a laser beam that is focused at focusing positions, such that the focusing positions form a laser absorption region inside a structure comprising the GaN substrate and the semiconductor stack; and separating the GaN substrate from the semiconductor stack to form the GaN semiconductor device. |
地址 |
Ansan-si KR |