Method for manufacturing electronic component

摘要

A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.

主权项

1. A method for manufacturing an electronic component, comprising:
a first step of preparing a piezoelectric body with a flat surface; a second step of implanting ions into the piezoelectric body through the flat surface of the piezoelectric body such that an ion-implanted layer is formed in a region located at a predetermined depth from the flat surface of the piezoelectric body; a third step of forming sacrificial layers on a portion of the flat surface of the piezoelectric body; a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure; a fifth step of dividing the piezoelectric body at the ion-implanted layer by heating the piezoelectric body to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, the piezoelectric film being a portion of the piezoelectric body that is located between the flat surface of the piezoelectric body and the ion-implanted layer; a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, the portions corresponding to the sacrificial layers, the division surface extending along the ion-implanted layer; and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.