Wafer polishing apparatus

摘要

The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

主权项

1. A wafer polishing apparatus, comprising: a polishing plate having an upper face, on which a polishing cloth is adhered; a polishing head having an lower face for holding a wafer; and a slurry supplying section for supplying slurry to the upper face of the polishing plate,
wherein the wafer held by the polishing head is pressed onto the polishing cloth, the polishing plate and the polishing head are relatively moved with respect to each other, with supplying slurry, so as to polish the wafer, wherein the polishing plate includes:
a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; anda groove for discharging slurry being formed between the polishing zones, and wherein a head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.