| 发明名称 | Solid-state light emitting module | ||
| 摘要 | A solid-state light-emitting module includes a transparent substrate, a light emitting diode chip, a first package sealant, a second package sealant, and a wavelength selection structure layer. The transparent substrate includes a first surface, a second surface which is opposite to the first surface, and a side face surrounding and connecting the first surface and the second surface. The light emitting diode chip is fixed on the first surface to emit light with a first wavelength. The first package sealant is disposed on the first surface to cover the light emitting diode chip. The second package sealant is disposed on the second surface and opposite to the first package sealant. The wavelength selection structure layer is disposed on the side face of the transparent substrate for selectively reflecting or transmitting the light therethrough. | ||
| 申请公布号 | US9018670(B1) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201414305006 | 申请日期 | 2014.06.16 |
| 申请人 | Lextar Electronics Corporation | 发明人 | Lu Yu-Hsin |
| 分类号 | H01L33/00;H01L33/50;H01L33/54;H01L33/52;H01L33/20 | 主分类号 | H01L33/00 |
| 代理机构 | CKC & Partners Co., Ltd. | 代理人 | CKC & Partners Co., Ltd. |
| 主权项 | 1. A solid-state light emitting module, comprising: a transparent substrate comprising a first surface, a second surface opposite to the first surface, and a side face surrounding and connecting the first surface and the second surface; at least a light emitting diode chip fixed on the first surface to emit light with a first wavelength; a first package sealant disposed on the first surface to cover the light emitting diode chip; a second package sealant disposed on the second surface and opposite to the first package sealant; and a wavelength selection structure layer disposed on the side face of the transparent substrate for selectively reflecting or transmitting the light therethrough. | ||
| 地址 | Hsinchu TW | ||