发明名称 Method for forming diffusion regions in a silicon substrate
摘要 A method of manufacturing solar cells is disclosed. The method comprises depositing an etch-resistant dopant material on a silicon substrate, the etch-resistant dopant material comprising a dopant source, forming a cross-linked matrix in the etch-resistant dopant material using a non-thermal cure of the etch-resistant dopant material, and heating the silicon substrate and the etch-resistant dopant material to a temperature sufficient to cause the dopant source to diffuse into the silicon substrate.
申请公布号 US9018033(B2) 申请公布日期 2015.04.28
申请号 US201314061422 申请日期 2013.10.23
申请人 SunPower Corporation 发明人 Wu Kahn C.;Kraft Steven M.;Loscutoff Paul;Molesa Steven Edward
分类号 H01L21/00;H01L31/18;H01L31/028 主分类号 H01L21/00
代理机构 Blakely Sokoloff Taylor Zafman LLP 代理人 Blakely Sokoloff Taylor Zafman LLP
主权项 1. A method of manufacturing solar cells, the method comprising: forming a thin dielectric layer on a surface of a silicon substrate; forming a polysilicon layer over the thin dielectric layer; depositing, in liquid phase, an etch-resistant dopant material comprising a dopant source material and a solvent on the polysilicon layer; forming a cross-linked matrix in the etch-resistant dopant material using a non-thermal cure of the etch-resistant dopant material, the cross-linked matrix having a structure, and the non-thermal cure causing a phase change of the etch-resistant dopant material from liquid to solid; subsequently, removing the solvent from the etch-resistant dopant material without altering the structure of the cross-linked matrix; and heating the etch-resistant dopant material to a temperature wherein the dopant source material diffuses into the polysilicon layer.
地址 San Jose CA US