发明名称 |
Method for forming diffusion regions in a silicon substrate |
摘要 |
A method of manufacturing solar cells is disclosed. The method comprises depositing an etch-resistant dopant material on a silicon substrate, the etch-resistant dopant material comprising a dopant source, forming a cross-linked matrix in the etch-resistant dopant material using a non-thermal cure of the etch-resistant dopant material, and heating the silicon substrate and the etch-resistant dopant material to a temperature sufficient to cause the dopant source to diffuse into the silicon substrate. |
申请公布号 |
US9018033(B2) |
申请公布日期 |
2015.04.28 |
申请号 |
US201314061422 |
申请日期 |
2013.10.23 |
申请人 |
SunPower Corporation |
发明人 |
Wu Kahn C.;Kraft Steven M.;Loscutoff Paul;Molesa Steven Edward |
分类号 |
H01L21/00;H01L31/18;H01L31/028 |
主分类号 |
H01L21/00 |
代理机构 |
Blakely Sokoloff Taylor Zafman LLP |
代理人 |
Blakely Sokoloff Taylor Zafman LLP |
主权项 |
1. A method of manufacturing solar cells, the method comprising:
forming a thin dielectric layer on a surface of a silicon substrate; forming a polysilicon layer over the thin dielectric layer; depositing, in liquid phase, an etch-resistant dopant material comprising a dopant source material and a solvent on the polysilicon layer; forming a cross-linked matrix in the etch-resistant dopant material using a non-thermal cure of the etch-resistant dopant material, the cross-linked matrix having a structure, and the non-thermal cure causing a phase change of the etch-resistant dopant material from liquid to solid; subsequently, removing the solvent from the etch-resistant dopant material without altering the structure of the cross-linked matrix; and heating the etch-resistant dopant material to a temperature wherein the dopant source material diffuses into the polysilicon layer. |
地址 |
San Jose CA US |