Optical semiconductor package and method of manufacturing the same

摘要

In an optical semiconductor package, a method of manufacturing the same, and an optical semiconductor device according to the present invention, a thermosetting resin such as an unsaturated polyester resin is used for a reflector 5 or resin 6 exposed around an optical semiconductor element, thereby suppressing deterioration of resin and a reduction in reflectivity.

主权项

1. An optical semiconductor package, comprising:
a first lead having a mounting region for an optical semiconductor element on a major surface of the first lead; at least one second lead having a connecting region for a conductive material on a major surface of the second lead, the conductive material being used for conduction with the optical semiconductor element; a holding resin that adjoins and holds the mounting region of the first lead and the connecting region of the second lead; and a reflector disposed on top of the surfaces of the first lead and the second lead and surrounding a perimeter of the mounting region and the connecting region, wherein the holding resin and the reflector are formed as a single, injection molded structure with an unsaturated polyester resin, and the unsaturated polyester resin contains a filler composed of glass fibers and spherical silica, titanium oxide, and any additive agent and satisfies: 15%