| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper paste which can impart excellent conductivity and bendability to a conductor obtained by sintering a copper paste, and a method of producing a circuit board using the same.SOLUTION: A copper paste comprises copper particles, and thermoplastic resin comprising polyester resin. The thermoplastic resin content in the total content of copper particles and thermoplastic resin is 1-5 mass%.</p> |
