| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve precision in quality inspection for a connection state between the electronic part and the conductive pattern which are mounted on the circuit board.SOLUTION: The circuit board inspection device includes: a magnetic field detection part 4 for detecting the strength of the magnetic field generated when a detection signal Ss is supplied to the conductive pattern of a circuit board; and a processing part 7 for executing the quality inspection of a connection state between the electronic part and the conductive pattern on the basis of the strength of the magnetic field detected in a state where a magnetic field detection part 4 faces a specified position on the electronic part and executing a specifying process for previously specifying a specified position on the basis of the strength of the magnetic field detected by the magnetic field detection part 4 by controlling the movement of the magnetic field detection part 4 by a movement mechanism 5. The processing part 7 sequentially moves the magnetic field detection part 4 to each opposite position facing each divided section dividing the surface of the electronic part into a plurality of sections and executes a magnetic field strength specifying process for specifying the strength of the magnetic field for each opposite position, and specifies the divided section that is determined to satisfy the specified condition in which the specified strength of the magnetic field is previously specified as the specified position in the specifying process.</p> |
