| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a suspension lead structure which does not cause a short circuit caused by contact of neighboring wires when a product class of a chip is changed or wire sweep occurs.SOLUTION: The semiconductor device comprises suspension leads 30 which connect each corner of a rectangular lead frame 100 with each corner of a die pad 10 lying in the center of the lead frame 100 and which are arranged between the corners of the lead frame 100 and the corners of the die pad 10 so as to be bent in a horizontal direction. Positions of regions for wire bonding of inner leads 40 arranged near the corners of the lead frame 100 are placed on positions of space areas produced by bending of the suspension leads 30. As a result, by changing a shape of the inner lead 40 by utilizing the space areas produced by deformation of the suspension lead 30, a chip can be mounted without concern for a wire short circuit. |
