INSULATING SUBSTRATE FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an insulating substrate for a printed circuit board and a printed circuit board, capable of improving fill plating properties of an inner layer via hole.SOLUTION: An insulating substrate 100 for a printed circuit board according to the present invention includes an electric insulating resin 110 and a plurality of reinforcement materials 120 formed in the electric insulating resin. The plurality of reinforcement materials are configured so that one or more reinforcement materials 121, 123 are formed to be symmetrical with each other at each of the upper and lower portions based on a central reinforcement material 122 formed at a central portion in the electric insulating resin, and a thickness of the central reinforcement material is thicker than those of the other reinforcement materials. A printed circuit board according to the present invention includes an insulating substrate and a via penetrating through the insulating substrate. The insulating substrate includes an electric insulating resin and the plurality of reinforcement materials formed in the electric insulating resin. The plurality of reinforcement materials are configured so that one or more reinforcement materials are formed to be symmetrical with each other at each of the upper and lower portions based on a central reinforcement material formed at a central portion in the electrical insulating resin, and a thickness of the central reinforcement material is thicker than those of the other reinforcement materials.