发明名称 CONDUCTIVE BONDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a conductive bonding material which is excellent in a heat cycle characteristic in a high-temperature range (e.g., about from 600°C to 800°C) and has sufficient electrical conductivity.SOLUTION: The conductive bonding material contains perovskite-type oxide powder and glass frit. The perovskite-type oxide contains a composite copper oxide and a cobaltite represented respectively by the general formula (1) defined by (LnM)(CuM)Oand the general formula (2) defined by (LnSr)(CoM)O. The glass frit has a softening point in the range from 600°C to 800°C inclusive.
申请公布号 JP2015081216(A) 申请公布日期 2015.04.27
申请号 JP20130220314 申请日期 2013.10.23
申请人 NORITAKE CO LTD 发明人 IWAI HIROYUKI
分类号 C03C8/24;H01B1/14;H01B1/20;H01M8/02;H01M8/12 主分类号 C03C8/24
代理机构 代理人
主权项
地址