发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device having a holding table which is not broken even when laser beam in an infrared light region is radiated thereto.SOLUTION: The laser processing device comprises: holding means for holding a workpiece; laser beam radiation means for radiating laser beam in an infrared light region to the workpiece held by the holding means; and processing feed means for moving the holding means and the laser beam radiation means relatively in the processing feed direction. The holding means has a holding table for holding the workpiece on an upper surface, and a table base for supporting the holding table, and the holding table is formed of silicon.
申请公布号 JP2015080804(A) 申请公布日期 2015.04.27
申请号 JP20130220086 申请日期 2013.10.23
申请人 DISCO ABRASIVE SYST LTD 发明人 AIKAWA RIKI;OBA RYUGO
分类号 B23K26/10;B23K26/08;B23Q3/08;H01L21/301 主分类号 B23K26/10
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