| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device and a laser processing method, capable of increasing processing speed and reducing cost.SOLUTION: A laser processing device 1 comprises: a forming mask 212 disposed between a light focusing body 200 and a substrate 2, through which a tapered hole 211 becoming narrower continuously as coming close to the substrate 2 in a direction along a light axis is formed, and irradiating a focused laser beam to the substrate 2 for forming an irradiation shape while reflecting a part of the focused laser beam on a side surface of the tapered hole 211; and a mechanism part 213 disposed at at least one of the light focusing body 200 and the forming mask 212, and changing a relative position between the light focusing body 200 and the forming mask 212 so that the irradiation shape becomes a desired shape by reflecting the part of the focused laser beam on the side surface of the tapered hole 211 and irradiating the remnant to the substrate 2. |
