| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which is arranged so that when rinsing a wafer after peeling off a support member from the wafer, the dissolution of a sheet-like resin composition is suppressed, and allows semiconductor devices to be manufactured with good yield.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: (A) preparing a wafer; (B) bonding a support member including a base and a temporarily fixing layer formed on the base to a second principal surface of the wafer through the temporarily fixing layer; (C) preparing a dicing tape with an ultraviolet curable sheet-like resin composition laminated thereto; (D) bonding the sheet-like resin composition on the dicing tape to a first principal surface of the wafer; (E) peeling off the support member from the wafer after the step (D); (F) rising the second principal surface of the wafer after the step (E); and (S) curing, by ultraviolet irradiation, a peripheral part of the sheet-like resin composition which does not overlap with the wafer in plane view after the step (D) and before the step (F). |
