| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive bonding material which has sufficient bondability, and by which the occurrence of a trouble attributed to migration can be prevented even in the case of using in a high-temperature region (e.g. 650-800°C).SOLUTION: A conductive bonding material comprises: powder of perovskite type oxide; and a glass frit. In the conductive bonding material, (1) the perovskite type oxide is represented by the general formula below; and (2) the glass frit has a softening point in a range of 600-800°C. (LnM)(CuM)O, where Ln represents one or more elements selected from lanthanoids; Mrepresents one or more elements selected from a group consisting of Sr, Ca and Ba; Mrepresents one or more elements selected from a group consisting of Co, Mn, Ni and Fe; "a" and "b" are real numbers which satisfy -0.3≤a≤0.3 and 0≤b<2; and δ represents a value determined to meet a charge neutral condition. |
