发明名称 ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic device, electronic equipment, and manufacturing method of the electronic device with which a plurality of electronic components can be effectively cooled with a simple configuration.SOLUTION: An electronic device includes a first circuit board, a heat sink that is fixed above the first circuit board with a predetermined space, and a plurality of electronic components that have different heights from each other and are fixed to the surface of the heat sink arranged opposite to the first circuit board, where the plurality of electronic components are electrically connected with the first circuit board via a second circuit board having flexibility.
申请公布号 JP2015082576(A) 申请公布日期 2015.04.27
申请号 JP20130219674 申请日期 2013.10.22
申请人 FUJITSU LTD 发明人 IZUNO KISHUN;SAITO OSAMU;HAYASHI MITSUAKI;JOKO KENJI;MATSUMOTO HIDEAKI;FUJII MINORU
分类号 H01L23/36;H01L23/40;H05K1/14;H05K7/14;H05K7/20 主分类号 H01L23/36
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