发明名称 SPUTTERING TARGET AND METHOD FOR MANUFACTURING SPUTTERING TARGET
摘要 <p>PROBLEM TO BE SOLVED: To provide a sputtering target that does not need an extra-manufacturing facility and is excellent in post-sputtering property, and to provide a method for manufacturing the same.SOLUTION: The sputtering target is integrally formed from a plurality of parts that are divided into small pieces of single metal to be a target material by hot isostatic press (HIP) and diffused junction. There is also provided the method for manufacturing the sputtering target.</p>
申请公布号 JP2015081355(A) 申请公布日期 2015.04.27
申请号 JP20130218646 申请日期 2013.10.21
申请人 TOSHIBA CORP;TOSHIBA MATERIALS CO LTD 发明人 KOMATSU TORU
分类号 C23C14/34;B22F3/24;H01L21/285 主分类号 C23C14/34
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