发明名称 |
SILICON NITRIDE FILLER, RESIN COMPOSITE, INSULATING SUBSTRATE, AND SEMICONDUCTOR SEALANT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silicon nitride filler that exhibits high heat radiation performance when added to rubber, resin or the like constituting an insulation member to make a resin composite.SOLUTION: A silicon nitride filler comprises 50 vol.% or more of coagulation particles with a particle size of 5μm or more and 200μm or less, the coagulation particles containing silicon nitride particles of a columnar shape.</p> |
申请公布号 |
JP2015081205(A) |
申请公布日期 |
2015.04.27 |
申请号 |
JP20130218602 |
申请日期 |
2013.10.21 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY |
发明人 |
HIRAO KIYOSHI;HOTTA YUJI;HIUGA HIDEKI;SHIMAMURA AKIHIRO |
分类号 |
C01B21/068;C08K3/34;C08L63/00;C08L101/00 |
主分类号 |
C01B21/068 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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