| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that, for a recording element substrate in which an ink supply port is formed by a silicon removal process, the stress produced by expansion and contraction of an underfill material may cause deformation or breakage of a portion of which rigidity is fragile, starting from the portion to which the silicon removal process has been applied.SOLUTION: A liquid ejection head includes: a recording element substrate provided with a substrate and a flow-path-forming member for forming a flow path in a principal surface of the substrate; a support member supporting the recording element substrate; and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other. Here, the flow-path-forming member is formed so that an end portion thereof projects further forward than at least one side surface of the substrate, and the underfill material covers an external surface of the joint portion and covers at least the one side surface of the substrate so that the underfill material reaches the projecting end portion of the flow-path-forming member.</p> |
