| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which allows for cost reduction by simplifying the connection and assembly of a semiconductor substrate and a planar metal member, e.g., a terminal piece, and to provide a method of manufacturing an electronic component.SOLUTION: An electronic component includes a resin frame 19, a semiconductor substrate 15 accommodated in the resin frame, a planar metal member 14 at least one end of which is fixed in the resin frame at a position separated from the semiconductor substrate, an electrical connection region 27 formed of a conductive material on the planar metal member side surface of the semiconductor substrate, and a solder layer 28 formed on the planar metal member side surface of the electrical connection region. The planar metal member supports the semiconductor substrate in non-contact, via the solder layer and the electrical connection region, and is connected electrically therewith. |
