发明名称 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a compound semiconductor device that allows preventing a leakage current flowing between a source and a drain, and to provide a method of manufacturing the same.SOLUTION: A compound semiconductor device includes: a superlattice buffer layer 101 composed of a first AlGaN layer 101a having a first Al composition and a second AlGaN layer 101b being thinner than the first AlGaN layer 101a and having a second Al composition higher than the first Al composition; a channel layer 102 formed above the superlattice buffer layer 101; a carrier supply layer 103 formed on the channel layer 102; a gate electrode 104 formed on the carrier supply layer 103; and a source electrode 105 and a drain electrode 106. The compound semiconductor device further includes a third AlGaN layer 107, between the superlattice buffer layer 101 and the channel layer 102, being thicker than the second AlGaN layer 101b and having a third Al composition higher than the first Al composition. The first Al composition is greater than or equal to 0 to less than 1, and the second Al composition and the third Al composition are greater than 0 to less than or equal to 1.
申请公布号 JP2015082599(A) 申请公布日期 2015.04.27
申请号 JP20130220276 申请日期 2013.10.23
申请人 FUJITSU LTD 发明人 KOTANI JUNJI;NAKAMURA TETSUKAZU
分类号 H01L21/338;H01L21/205;H01L29/778;H01L29/812 主分类号 H01L21/338
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