| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a compact resin sealing die ensuring the high yield of molding, without causing any wrinkle and slack in a release film.SOLUTION: In a resin sealing die, the outer peripheral edge of a release film 61 can be pressed against the joint surface 21 of a lower die 10, by means of a resin material supply loader 50 consisting of a lower die 10 where film suction holes 25, 26 are arranged in the joint surface 21 provided around an opening cavity 31, and a release film 61 covering the cavity 31 and having an outer peripheral edge being sucked to the film suction holes 25, 26 and held in place, and having a compression surface 51 arranged oppositely to the joint surface 21 of a lower die 10. In particular, an annular protrusion 22 one step higher than the joint surface 21 is provided between the cavity 31 and the joint surface 21.</p> |
