| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device that has, to a small-size semiconductor substrate, high positioning accuracy and contact accuracy between an inspection electrode and a probe in its integrated circuit, and that can inspect a state of the entire semiconductor substrate while observing it at that place, and that is low in cost and small in size.SOLUTION: A semiconductor inspection device 100 comprises: a semiconductor substrate placing table 213 placing a semiconductor substrate; a transparent probe substrate 217 provided with a bump abutting on an inspection electrode of the semiconductor substrate; and a camera 222 arranged at a position opposed to the semiconductor substrate via the probe substrate 217. The camera 222 captures a region, as an image, including a plurality of first positioning marks and electrode pads formed on the semiconductor substrate and a plurality of second positioning marks and probe terminals formed on the probe substrate 217. A position controller 232 measures a position shift amount from the image and controls a position adjustment stage 212, and thereby adjusts a position of the semiconductor substrate placed on the semiconductor substrate placing table 213.</p> |
