PRINTED CIRCUIT BOARD MANUFACTURING METHOD, PRINTED CIRCUIT BOARD UNIT MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To inhibit generation of a solder bridge and the occurrence of contact failure of a probe with a land.SOLUTION: A printed circuit board manufacturing method comprises: a process of forming on a substrate having a first conductor, a hole and a second conductor around the hole, an insulation film having a first opening from which a part of the second conductor and an opening of the hole are exposed; and a process of making a probe contact the second conductor. An exposure area of the second conductor centered on the hole and on the first conductor side is smaller than an exposure area of the second conductor centered on the hole and on the side opposite to the first conductor.