| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solder unit capable of soldering with high quality, and having a simple structure.SOLUTION: A solder unit 10 comprises: a metal lump 20; a ceramic pipe 30 disposed by penetrating the metal lump 20 in a vertical direction; a heater 40 for heating the metal lump 20; a temperature sensor 50 for detecting temperature of the metal lump 20; and a heat insulation member 60 for fixing the metal lump 20 to a base table of a solder device. Into the ceramic pipe 30, a solder wire material 31 is inserted, and the solder wire material 31 is molten in the ceramic pipe 30.</p> |
