THREE DIMENSIONAL LAMINATED WIRING SUBSTRATE

摘要

Provided is a three dimensional laminated wiring substrate which can be housed in a restricted space and enables highly reliable high density wiring. A three dimensional laminated wiring substrate (1) comprises a plurality of laminated three dimensional wiring substrates (11 12 13). Each of the three dimensional wiring substrates (11 12 13) has an insulating film (111) and a conductor pattern (112). The insulating film (111) is formed to constitute a three dimensional solid plane. The conductor pattern (112) extends on the three dimensional solid plane of the insulating film (111).