| 摘要 |
<p>The present invention relates to a polishing pad manufacturing method comprising: a step for spreading polishing particles on an upper side of a mold; a step for forming a coating layer on the upper side of the mold; a step for removing the mold from the coating layer; and a step for exposing some of the polishing particles by etching a lower side of the coating layer. The polishing pad manufacturing method can expose the individual polishing particles uniformly depending on the degree of conditioner surface etching.</p> |
