| 摘要 |
<p>The present invention has a subject of breaking along a brake line a resin layer of a complex substrate whose substrate part is broken preliminarily as a complex substrate wherein a resin layer is coated on a substrate having a number of functional areas formed with an alignment in vertical and horizontal directions. To this end, the present invention is configured to dispose a complex substrate (10) on an elastic support plate (40). The elastic support plate (40) has a frame shape part (42) which is slightly greater than surrounding complex substrates. By installing the frame shape part (42), the frame shape part (42) is indented even for the most distant circumference chip alike different chips and the elastic support plate (40) is deformed, whereby breaking may be performed.</p> |
