| 发明名称 |
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies |
| 摘要 |
A package includes a die stack that includes at least two stacked dies, and a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top surface of the die stack, and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies. A first metallic heat-dissipating feature is over and contacting the top portion of TIM. A second metallic heat-dissipating feature has a sidewall contacting a sidewall of the sidewall portion of the TIM. |
| 申请公布号 |
US2015108628(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201314056390 |
申请日期 |
2013.10.17 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Yu Chen-Hua;Hung Wensen;Huang Szu-Po;Su An-Jhih;Lee Hsiang-Fan;Chen Kim Hong;Wu Chi-Hsi;Jeng Shin-Puu |
| 分类号 |
H01L23/367;H01L23/42 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a die stack comprising at least two stacked dies; a Thermal Interface Material (TIM) comprising:
a top portion over and contacting a top surface of the die stack; anda sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies; a first metallic heat-dissipating feature over and contacting the top portion of the TIM; and a second metallic heat-dissipating feature comprising a sidewall contacting a first sidewall of the sidewall portion of the TIM. |
| 地址 |
Hsin-Chu TW |
