| 摘要 |
965,158. Soldering. BROWN, BOVERI & CO. Ltd. Nov. 15, 1962 [Nov. 17, 1961], No. 43339/62. Heading B3R. [Also in Division H1] In a soldered joint between metal members in a semi-conductor arrangement a porous support member is provided between and soft soldered to two other metallic members. In the embodiment a silica controlled rectifier includes a silicon disc 7 sandwiched between molyldenum plates 8 and 9 with the carrier plate 8 soft soldered to a porous molybdenum block 10 itself soldered with a lead-tin based solder to the copper base 1 of a containing housing. The pore volume of the support member may vary uniformly from 0 to 80% in the axial direction between the carrier plate and the metal housing base 1 or may decrease in the radial direction between the same limits from the edge to the centre. The support member may be of tungsten, copper, chromium, platinum, palladium, gold, iron or nickel. The housing parts are subsequently brazed in gastight fashion and evacuated or filled with a protective gas. |
