SYSTEM AND METHOD IN MOUNTING OF IMAGE PICKUP DEVICE ON FLEXIBLE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a system and a method for reducing the arrangement problem of a digital camera module.SOLUTION: A digital camera module 200 includes an image pickup device 204. The image pickup device 204 is directly installed on a flexible circuit board 202 by using an adhesive. The flexible circuit board 202 includes a flexible base layer, first and second conductive tracing layers formed on the flexible base layer, a plurality of first contact pads for the image pickup device, and a connector 214. Each of the first contact pads consists of a layer formed of nickel bonded onto the first conductive tracing layer and a layer formed of gold bonded onto the layer formed of the nickel. Each of the first contact pads is connected to the connector 214 in a state where the flexible circuit board 202 is bent.