| 发明名称 |
IMAGE INSPECTION METHOD OF DIE TO DATABASE |
| 摘要 |
An image inspection method of die to database is provided, and the positions in the to-be-inspected chips within one wafer may be selected. In the method, a plurality of inspection areas in a plurality of positions in the to-be-inspected chips within a wafer are selected, a plurality of raw images of the inspection areas are obtained, and a plurality of locations of the raw images are then decoded. After that, an image extraction is performed on the raw images to obtain a plurality of image contours. Thereafter, the image contours are compared with a design database of the chip in order to obtain a result of a defect inspection, and execute the same thing in whole wafer. |
| 申请公布号 |
US2015110384(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201414274177 |
申请日期 |
2014.05.09 |
| 申请人 |
MACRONIX International Co., Ltd. |
发明人 |
Luoh Tuung;Liao Hsiang-Chou;Yang Ling-Wuu;Yang Ta-Hone;Chen Kuang-Chao |
| 分类号 |
G06T7/00 |
主分类号 |
G06T7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image inspection method of die to database, comprising:
selecting a plurality of inspection areas in a plurality of positions in to-be-inspected chips within a wafer; obtaining a plurality of raw images of the inspection areas; decoding a plurality of locations of the raw images; performing an image extraction on the raw images to obtain a plurality of image contours; and comparing the image contours with a design database of the wafer to obtain a result of a defect inspection of the positions in the to-be-inspected chips within the wafer. |
| 地址 |
Hsinchu TW |
