THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING

摘要

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

主权项

1. An integrated circuit assembly comprising:
an insulating layer having a first surface and a second surface, the first surface of the insulating layer being less than 10 microns below an upper plane of the integrated circuit assembly; an active layer contacting the first surface of the insulating layer; a metal bond pad formed on the second surface of the insulating layer; wherein the metal bond pad is electrically connected to the active layer; and a printed circuit board electrically connected to the metal bond pad; wherein the insulating layer, active layer, metal bond pad and printed circuit board are located below the upper plane.