发明名称 Plasma Processing Apparatus
摘要 A plasma processing apparatus includes a plasma generation chamber in which plasma active species are generated, a process chamber configured to accommodate processing target objects stacked in a vertical direction, the plasma active species generated in the plasma generation chamber being supplied into the process chamber, a plasma source gas supply pipe disposed inside the plasma generation chamber and extending in the vertical direction, a plasma source gas being introduced from one end of the plasma source gas supply pipe and discharged through gas discharge holes formed in the plasma source gas supply pipe in the vertical direction, and a pair of plasma electrodes, arranged to face each other, configured to apply an electric field to the plasma source gas discharged into the plasma generation chamber. A size of a discharge area interposed between the pair of plasma electrodes is varied in the vertical direction.
申请公布号 US2015107517(A1) 申请公布日期 2015.04.23
申请号 US201414518151 申请日期 2014.10.20
申请人 TOKYO ELECTRON LIMITED 发明人 HASEBE Kazuhide;OGAWA Jun;SHIMIZU Akira
分类号 C23C16/455;C23C16/509 主分类号 C23C16/455
代理机构 代理人
主权项 1. A plasma processing apparatus comprising: a plasma generation chamber in which plasma active species are generated; a process chamber configured to accommodate therein processing target objects which are stacked in a vertical direction, the plasma active species generated in the plasma generation chamber being supplied into the process chamber; a plasma source gas supply pipe disposed inside the plasma generation chamber and extending in the vertical direction, a plasma source gas serving as a plasma source being introduced from one end of the plasma source gas supply pipe and discharged through a plurality of gas discharge holes which is formed in the plasma source gas supply pipe in the vertical direction; and a pair of plasma electrodes, arranged to face each other, configured to apply an electric field to the plasma source gas discharged into the plasma generation chamber, wherein a size of a discharge area interposed between the pair of plasma electrodes is varied in the vertical direction.
地址 Tokyo JP