发明名称 |
HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE |
摘要 |
<p> A heat-conductive pressure-sensitive adhesive layered sheet (F) provided with a heat-conductive pressure-sensitive adhesive layer having heat conducting properties and pressure-sensitive adhesive properties, and a non-adhesive layer not having pressure-sensitive adhesive properties, the heat-conductive pressure-sensitive adhesive layer being obtained by a polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) in a mixed composition including 100 parts by mass of a (meth)acrylic resin composition (A) including a (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (α1), 350 parts by mass to 1200 parts by mass of a flame-retardant heat-conductive inorganic compound (C), and 1 part by mass to 40 parts by mass of a tackifier (D), and the thickness of the non-adhesive layer being 70 µm or less.</p> |
申请公布号 |
WO2015056577(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
WO2014JP76435 |
申请日期 |
2014.10.02 |
申请人 |
ZEON CORPORATION |
发明人 |
KUMAMOTO, TAKUROU;KITAGAWA, HIROMI |
分类号 |
C09J7/02;C09J11/04;C09J11/08;C09J133/06;H05K7/20 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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