发明名称 HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, METHOD FOR MANUFACTURING HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE LAYERED SHEET, AND ELECTRONIC DEVICE
摘要 <p> A heat-conductive pressure-sensitive adhesive layered sheet (F) provided with a heat-conductive pressure-sensitive adhesive layer having heat conducting properties and pressure-sensitive adhesive properties, and a non-adhesive layer not having pressure-sensitive adhesive properties, the heat-conductive pressure-sensitive adhesive layer being obtained by a polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) in a mixed composition including 100 parts by mass of a (meth)acrylic resin composition (A) including a (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (α1), 350 parts by mass to 1200 parts by mass of a flame-retardant heat-conductive inorganic compound (C), and 1 part by mass to 40 parts by mass of a tackifier (D), and the thickness of the non-adhesive layer being 70 µm or less.</p>
申请公布号 WO2015056577(A1) 申请公布日期 2015.04.23
申请号 WO2014JP76435 申请日期 2014.10.02
申请人 ZEON CORPORATION 发明人 KUMAMOTO, TAKUROU;KITAGAWA, HIROMI
分类号 C09J7/02;C09J11/04;C09J11/08;C09J133/06;H05K7/20 主分类号 C09J7/02
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