| 摘要 |
<p>Some embodiments include a method. The method can include providing a carrier substrate. The carrier substrate has an edge, a first surface, and a second surface opposite the first surface. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate. The flexible substrate has an edge, a first surface, and a second surface opposite the first surface. Further still, the method can include coupling the second surface of the flexible substrate to the first surface of the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive after coupling the second surface of the flexible substrate to the first surface of the carrier substrate. Other embodiments of related methods and devices are also disclosed.</p> |
