SEMICONDUCTOR DEVICE WITH HEAT SPREADER

摘要

A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.

主权项

1. A semiconductor device, comprising:
a package body having a top main surface and an opposing, bottom mounting surface; a semiconductor die encapsulated in the package body and having an active surface facing the top main surface of the package body and an opposing bottom surface facing the bottom mounting surface of the package body; and a heat spreader disposed within a recess in the top main surface of the package body and spaced from the active surface of the semiconductor die by a portion of the package body, wherein the heat spreader conducts heat generated by the semiconductor die.