EPOXY-RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN LAYER, METAL-BASED CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

This epoxy-resin composition is used to form an insulating resin layer (102) that is part of a metal-based circuit board (100) provided with the following: a metal substrate (101); the insulating resin layer (102), which is provided on top of the metal substrate (101); and a metal layer (103) provided on top of the insulating resin layer (102). This epoxy-resin composition contains an epoxy resin and alumina. Alumina constitutes between 75% and 95%, inclusive, of the total mass of the solid content of this epoxy-resin composition.