| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem occurring when a resin encapsulated semiconductor device is used in an inhospitable environment such as high humidity and high temperature that bubbles are generated and remain inside a coating material coated on a surface of a semiconductor chip for improving humidity resistance to form a new moisture invasion route and fail to ensure sufficient reliability.SOLUTION: In a semiconductor device, a storage elastic modulus (1 Hz) of a coating material at 260°C and under which is coated on a surface of a semiconductor chip mounted on a resin encapsulated semiconductor device so as to cover the surface is set at 50 MPa to 1000 MPa. Or a loss elastic modulus (1 Hz) of the coating material at 260°C and under is set at 1.1 MPa to 10 MPa. |
