发明名称 SELF ALIGNED CONTACT FORMATION
摘要 The present disclosure relates to methods of forming a self-aligned contact and related apparatus. In some embodiments, the method forms a plurality of gate lines interspersed between a plurality of dielectric lines, wherein the gate lines and the dielectric lines extend in a first direction over an active area. One or more of the plurality of gate lines are into a plurality of gate line sections aligned in the first direction. One or more of the plurality of dielectric lines are cut into a plurality of dielectric lines sections aligned in the first direction. A dummy isolation material is deposited between adjacent dielectric sections in the first direction and between adjacent gate line sections in the first direction. One or more self-aligned metal contacts are then formed by replacing a part of one or more of the plurality of dielectric lines over the active area with a contact metal.
申请公布号 US2015108651(A1) 申请公布日期 2015.04.23
申请号 US201414583864 申请日期 2014.12.29
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Chen Neng-Kuo;Yu Shao-Ming;Huang Gin-Chen;Hsu Chia-Jung;Sun Sey-Ping;Wann Clement Hsingjen
分类号 H01L23/528;H01L23/532;H01L29/49;H01L27/088 主分类号 H01L23/528
代理机构 代理人
主权项 1. An integrated chip, comprising: a plurality of gate lines extending in a first row over one or more active areas; a first dummy isolation material disposed in the first row between adjacent ones of the plurality of gate lines; a plurality of self-aligned contacts disposed in a second row, which is parallel with and adjacent to the first row, at positions over the one or more active areas; and a second dummy isolation material disposed in the second row between adjacent ones of the plurality of self-aligned contacts.
地址 Hsin-Chu TW