发明名称 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
摘要 A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.
申请公布号 US2015108587(A1) 申请公布日期 2015.04.23
申请号 US201314057095 申请日期 2013.10.18
申请人 UNITED MICROELECTRONICS CORP. 发明人 Chen Wei-Chih;Tsai Chung-Hsien;Chen Tung-Ming;Chang Chih-Sheng;Huang Jun-Chi;Lin Chih-Jen;Lin Yu-Hsiang
分类号 H01L29/78;H01L29/423;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method for forming a semiconductor structure, comprising: forming a gate electrode layer on a substrate; forming a spacer structure on a sidewall of the gate electrode layer; forming a dielectric cap film to cover the gate electrode layer and the spacer structure; and performing a source/drain implantation to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.
地址 Hsinchu TW