发明名称 |
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
摘要 |
A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation. |
申请公布号 |
US2015108587(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
US201314057095 |
申请日期 |
2013.10.18 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Chen Wei-Chih;Tsai Chung-Hsien;Chen Tung-Ming;Chang Chih-Sheng;Huang Jun-Chi;Lin Chih-Jen;Lin Yu-Hsiang |
分类号 |
H01L29/78;H01L29/423;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a semiconductor structure, comprising:
forming a gate electrode layer on a substrate; forming a spacer structure on a sidewall of the gate electrode layer; forming a dielectric cap film to cover the gate electrode layer and the spacer structure; and performing a source/drain implantation to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation. |
地址 |
Hsinchu TW |