发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A manufacturing method for a semiconductor device includes providing a substrate having at least agate structure formed thereon and a first spacer formed on sidewalls of the gate structure, performing an ion implantation to implant dopants into the substrate, forming a disposal spacer having at least a carbon-containing layer on the sidewalls of the gate structure, the carbon-containing layer contacting the first spacer, and performing a thermal treatment to form a protecting layer between the carbon-containing layer and the first spacer. |
申请公布号 |
US2015108553(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
US201414583211 |
申请日期 |
2014.12.26 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Chou Ling-Chun;Wang I-Chang;Hung Ching-Wen |
分类号 |
H01L29/78;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a gate structure; a first spacer positioned on sidewalls of the gate structure; a second spacer positioned on the first spacer; a SiCN-based protecting layer formed between the first spacer and the second spacer; and epitaxial layers respectively positioned at two sides of the second spacer. |
地址 |
Hsin-Chu City TW |