发明名称 SEMICONDUCTOR DEVICE
摘要 A manufacturing method for a semiconductor device includes providing a substrate having at least agate structure formed thereon and a first spacer formed on sidewalls of the gate structure, performing an ion implantation to implant dopants into the substrate, forming a disposal spacer having at least a carbon-containing layer on the sidewalls of the gate structure, the carbon-containing layer contacting the first spacer, and performing a thermal treatment to form a protecting layer between the carbon-containing layer and the first spacer.
申请公布号 US2015108553(A1) 申请公布日期 2015.04.23
申请号 US201414583211 申请日期 2014.12.26
申请人 UNITED MICROELECTRONICS CORP. 发明人 Chou Ling-Chun;Wang I-Chang;Hung Ching-Wen
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device comprising: a gate structure; a first spacer positioned on sidewalls of the gate structure; a second spacer positioned on the first spacer; a SiCN-based protecting layer formed between the first spacer and the second spacer; and epitaxial layers respectively positioned at two sides of the second spacer.
地址 Hsin-Chu City TW