发明名称 PACKAGE SEALING LID WITH BRAZING FILLER METAL, METHOD FOR MANUFACTURING THE SAME, PACKAGE-TYPE ELECTRONIC PART SEALING METHOD BY USE OF PACKAGE SEALING LID, AND PACKAGE-TYPE ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide: a sealing lid with a brazing filler metal which can withstand the heating at the time of mounting, bonding, or repair while avoiding degrading or damaging an electronic part such as a SAW device or quartz vibrator package; a method for manufacturing such a sealing lid with a brazing filler metal; and a package-sealing method by use of such a sealing lid with a brazing filler metal.SOLUTION: A package-sealing lid with a brazing filler metal for a package-type electronic part comprises a brazing filler metal for sealing use which is rigidly attached to a sealing-bond face, provided that the brazing filler metal includes Au/Sn/Ge alloy having a melting point of 300-350°C. The brazing filler metal for sealing use includes a total of 14 wt.% or more of Sn and Ge with the balance consisting of Au and inevitable substances. The difference between Sn and Ge in blended amount is 3-6 wt.%.
申请公布号 JP2015079866(A) 申请公布日期 2015.04.23
申请号 JP20130216391 申请日期 2013.10.17
申请人 SUMITOMO METAL MINING CO LTD 发明人 SUESHIGE YOSHITAKA
分类号 H01L23/02;B23K1/00;B23K31/02;B23K35/30;C22C5/02 主分类号 H01L23/02
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