发明名称 |
PACKAGE SEALING LID WITH BRAZING FILLER METAL, METHOD FOR MANUFACTURING THE SAME, PACKAGE-TYPE ELECTRONIC PART SEALING METHOD BY USE OF PACKAGE SEALING LID, AND PACKAGE-TYPE ELECTRONIC PART |
摘要 |
PROBLEM TO BE SOLVED: To provide: a sealing lid with a brazing filler metal which can withstand the heating at the time of mounting, bonding, or repair while avoiding degrading or damaging an electronic part such as a SAW device or quartz vibrator package; a method for manufacturing such a sealing lid with a brazing filler metal; and a package-sealing method by use of such a sealing lid with a brazing filler metal.SOLUTION: A package-sealing lid with a brazing filler metal for a package-type electronic part comprises a brazing filler metal for sealing use which is rigidly attached to a sealing-bond face, provided that the brazing filler metal includes Au/Sn/Ge alloy having a melting point of 300-350°C. The brazing filler metal for sealing use includes a total of 14 wt.% or more of Sn and Ge with the balance consisting of Au and inevitable substances. The difference between Sn and Ge in blended amount is 3-6 wt.%. |
申请公布号 |
JP2015079866(A) |
申请公布日期 |
2015.04.23 |
申请号 |
JP20130216391 |
申请日期 |
2013.10.17 |
申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
SUESHIGE YOSHITAKA |
分类号 |
H01L23/02;B23K1/00;B23K31/02;B23K35/30;C22C5/02 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|